Aavid Thermalloy, LLC

LGA1257 PROD-UCTS Technical Datasheet

Please Note - Our automatic algorithm was only able to extract the following potential part number(s) from this PDF datasheet: LGA1257 PROD-UCTS

D2PAK330 PROD-UCTS Technical Datasheet

Please Note - Our automatic algorithm was only able to extract the following potential part number(s) from this PDF datasheet: D2PAK330 PROD-UCTS

Pentium® 4 1-U High Performance Heat Sink

Rely on Aavid Thermalloy's high performance heat pipe heat sink where head room is limited and power dissipation is critical . This style of heat sink is easily customized to optimize fin spacing, overall width, and number of fins for your application. The base can also be made from copper for a 2 - 6 % performance increase depending on the airflow conditions. Other modifications possible include changing the heat sink height or flow length or extending the fins to the PCB for a 30% increase in fin height.

Pentium® 4 4-U High Performance Heat Sink

Rely on Aavid Thermalloy's high performance heat pipe heat sink where maximum thermal performance is required in a 4-U form factor. This style of heat sink can be customized to optimize fin spacing (even or uneven), overall height, number of fins, or base style. The base can utilize copper for a 2-4% performance increase (adds 225g) or other materials & configurations for low cost / high volume production.

Pentium® 4 2-U High Performance Heat Sink

Rely on Aavid Thermalloy's high performance heat pipe heat sink where design flexibility is required in a 2-U form factor. This style of heat sink can be customized to optimize fin spacing (even or uneven), overall height, number of fins, or base style. The base can utilize copper for a 2-4% performance increase (adds 225g) or other materials & configurations for low cost / high volume production. Another possible alteration is customized fin size, and the basic concept can be utilized for other processors and high power telco / power devices.

11-K754-01 (036113) CPU COOLER For AMD ATHLON®/DURON® FCPGA

1 Ball and 1 Sleeve Bearing,12VDC Fan,3 Pin Molex 2695 Connector or Equivalent,Pin 1 (-) Pin 2 (+) Pin 3 (FOO),Fan Speed is approximately 4200 RPM,Fan Noise less than 38 dBA,For fan variations including bearing type,speed, and interface materials, please,contact Application Engineering

COLUSA 850 CHIP SET COOLING SOLUTIONS

Easy Mounting to 850 Chip Set,Pre-Applied Interface Material,Shock Absorbing Gasket,Protects Chip and Package,Two Heights Available,Solder Anchor Required on PCB,Custom Variations Are Possible,Shipping in High Volume

COLUSA 860 CHIP SET COOLING SOLUTIONS

Easy Mounting to 860 Chip Set,Pre-Applied Interface Material,Shock Absorbing Gasket,Protects Chip and Package,Two Heights Available,Solder Anchor Required on PCB,Custom Variations Are Possible,Shipping in High Volume

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